Product Profile of UV-Tape for Wafer Dicing
Triton Consulting India offers UV-Tape for Wafer Dicing. Triton Consulting India supplies wide ranges of telecommunication, electronics, automobile, energy products of Furukawa Electric. UV-Tape for Wafer Dicing is basically adhesive tapes, prevents chip flying and makes it possible to minimize chipping during dicing. UV-Tape for Wafer Dicing`s adhesive becomes non-sticky when exposed to UV light.
UV-Tape for Wafer Dicing has the following features:
High adhesion secures dies in place and avoids chip flying and chipping during dicing.
Characteristics of near zero adhesion after UV irradiation makes it possible to pick up dies free of stress.
Specially designed adhesive makes easy die-pick-up possible, regardless of kinds of wafer surface.
No contamination with harmful ionic substances or with migration of adhesive and its additives.
