Product Profile of UV-Tape for BGA/CSP Package Dicing
Triton Consulting India supplies UV-Tape for BGA/CSP Package Dicing. Triton Consulting India offers wide ranges of telecommunication, electronics, automobile, energy products of Furukawa Electric. UV-Tape for BGA/CSP Package Dicing is adhesive tapes that have strong adhesive strength. UV-Tape for BGA/CSP Package Dicing can settle the wafers surely with the strong adhesive strength in the wafer dicing or grinding.
Key Features of UV-Tape for BGA/CSP Package Dicing
- High tuck strength avoids package flying during dicing.
- Characteristics of near zero adhesion after UV irradiation makes it possible to pick up diced package easily
- No peeling of ink marking.
- No adhesive residue in the laser marking area.
