Product Profile of Printed Circuit Assembly Flow-Soldering Flux
Printed Circuit Assembly Flow-Soldering Flux is a mixture of high quality WW resin and alcohol having solid content between 30-40%. The Flow-Soldering Flux is used where flux residue removal is not necessary or where the circuit is affected by low level current leakage. The Flow-Soldering Flux is mainly used for wire and component lead tinning. Printed Circuit Assembly Flow-Soldering Flux delivers non-corrosive residue and can be custom made in various grades as per specific requirements.
Key Features of Printed Circuit Assembly Flow-Soldering Flux
- A mixture of high quality WW resin and alcohol, having solid content between 30-40%. Used where flux residue removal is not necessary or where the circuit is affected by low level current leakage
- Mainly used for wire and component lead tinning
- Delivers non-corrosive residue
- Can be custom made in various grades as per specific requirements
