Product Profile of Potato Wafer Cutting Machine
Potato Wafer Cutting Machine is capable of slicing 550Kg. to 700Kg. of potatoes per hour. The Wafer Cutting Machine is available in stainless steel body operated by single or three phase motor 0.5 H.P. Hari Om Industries, an ISO 9001:2000 accredited company is manufacturing Potato Wafer Cutting Machine.
Hari Om Industries supplies a wide range of food processing machineries and equipments like slicer, cutting machine, grinder, peeler, fryer, shredder, mixer and crusher. The Potato Wafer Cutting Machine is designed without pulley belts and works with Auto Pressure System that enables setting thickness of the wafer to be cut.
Key Features of Potato Wafer Cutting Machine
- Electric Motor: 0.5 H.P. Single or Three Phase Motor.
- Made of: Stainless Steel Non Magnetic Grade [Export Quality], Aluminium.
- Designed without pulley belts.
- Working with Auto Pressure System.
- Can set wafer [chip] thickness or thinness as per need.
- Potato Wafer[Chip] Manufacturers.
- Dairy Farm Business.
- Catering Business.
- Hotels.
- Sansthan.
- Temples.
- Hostels.
- Dharamsala.
