Product Profile of Packaged Diamond Lapping Compound
Packaged Diamond Lapping Compound is available in 0-1/ 2 to 54-80 micron sizes. The Compound is used for different purposes such as- wire drawing dies, glass, tool, die makers and tool room. The Compound provides rapid, accurate lapping, polishing and super finishing. Packaged Diamond Lapping Compound is available in accurate formation and can be custom made in different grades as per specific requirements.
Applications of Packaged Diamond Lapping Compound:
Wire drawing dies
Glass
Tool
Die makers
Tool room
Key Features of Packaged Diamond Lapping Compound
- Available in 0-1/ 2 to 54-80 micron sizes
- Provides rapid, accurate lapping, polishing and super finishing
- Available in accurate formation
- Can be custom made in different grades as per specific requirements
