1 Ad

Multilayer Printed Circuit Board - PCB Assembly

Supplier : Interfab Electronics (I) Pvt. Ltd.

Key Features of Multilayer Printed Circuit Board - PCB Assembly
  • Constraint Driven
  • Floor planning and placement
  • Design partitioning and Interactive auto editing
  • Integrate high speed design analysis
  • Reduces the time required to design high speed interconnects and increases the likelihood of first pass success.
  • Shortens the time required to develop optimum constraints driven PCB designs flow
  • Eliminates the need for physical prototype for multiple qualification of multi-Gigabit per second serial links through advanced simulation techniques
Enquire now
Product Profile of Multilayer Printed Circuit Board - PCB Assembly
Interfab Electronics [I] Pvt. Ltd. manufactures Multilayer Printed Circuit Board - PCB Assembly. Interfab Electronics [I] Pvt. Ltd. is an ISO 9001:2000 certified company that supplies Printed Circuit Board Assemblies, Hybrid Micro Circuits, Surface Mount Technology [SMT], PCB Assemblies, etc. the Multilayer Printed Circuit Board - PCB Assembly is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or traces etched from copper sheets laminated onto a non-conductive substrate

Key Features of Multilayer Printed Circuit Board - PCB Assembly
  • Constraint Driven
  • Floor planning and placement
  • Design partitioning and Interactive auto editing
  • Integrate high speed design analysis
  • Reduces the time required to design high speed interconnects and increases the likelihood of first pass success.
  • Shortens the time required to develop optimum constraints driven PCB designs flow
  • Eliminates the need for physical prototype for multiple qualification of multi-Gigabit per second serial links through advanced simulation techniques
3 Ad

2 Ad