Product Profile of Multilayer Printed Circuit Board
Multilayer Printed Circuit Board is offered in a thickness of 0.8 to 3.2mm in copper finishing of 3 Oz for outer layers and 2 Oz for inner layers. The Printed Circuit Board is designed with a line width and spacing of 6/ 6 mils. The Printed Circuit Board is provided with minimum finished hole size of 0.3mm and comes in a 8 layered construction. Multilayer Printed Circuit Board can be availed with a surface finishing of solder levelling, lead-free hot air levelling, chemical tin or chemical gold.
Key Features of Multilayer Printed Circuit Board
- Thickness of 0.8 to 3.2mm [copper finishing of 3 oz for outer layers and 2 oz for inner layers].
- Line width and spacing of 6/ 6 mils.
- Minimum finished hole size of 0.3mm.
- Surface finishing of solder levelling, lead-free hot air levelling, chemical tin, chemical gold.
