Product Profile of Laser Cutting And Punching Machine
Laser Cutting and Punching Machine has minimal post-processing and high process speed. The Machine is suitable for cold laser cutting, structuring, drilling and ablating for industrial applications. The Machine has wave length ranging from 1064 and 532 mm and pulse width of 12 to 15 PS. The Machine has linear vertical polarization and 1 mm beam diameter. The Machine is used for cutting of brittle material like glass or sapphire, structuring of different materials and selective ablation of thin films in the nm-range without damaging other layers. The Laser Cutting and Punching Machine ensure safe and easy system integration and maintainability and have maximum 8 MW pulse peak power.
Application of Laser Cutting and Punching Machine:
Used for cutting of brittle material like glass or sapphire
Structuring of different materials
Selective ablation of thin films in the nm-range without damaging other layers.
Key Features of Laser Cutting And Punching Machine
- Minimal post-processing
- High process speed
- Safe and easy system integration and maintainability
- Maximum 8 MW pulse peak power
- Wave length ranging from 1064 and 532 mm
- Pulse width of 12 to 15 PS
