Product Profile of Large Base Flip Chip Bonder
Large Base Flip Chip Bonder is designed as a high-speed, high-accuracy platform for a wide range of flip chip processes. The Flip Chip Bonder is suitable for high volume of flip chip production. The Flip Chip Bonder is made using quality grade materials to ensure durability of use for a long time. The Large Base Flip Chip Bonder can be availed in different specifications to suit all application requirements
Key Features of Large Base Flip Chip Bonder
- Designed as a high-speed, high-accuracy platform for a wide range of flip chip processes
- Suitable for high volume of flip chip production
- Made using quality grade materials to ensure durability of use for a long time
- Can be availed in different specifications to suit all application requirements
