Product Profile of Lanner Embedded Platform
Pako Communications offers Lanner embedded platform, IMB-X63- ATX VIA C3- industrial main board with VGA/LAN/DDR/audio/CFII.
Industrial PCs are manufactured at a fully automatic, ISO 9001 manufacturing facility of 35000-sq.ft area of Lanner Taiwan.
Features: low power via CPL on ATX main-board support CPU; via eden fan-less CPU up to 733 MHz: via low power C3 CPU up to 1 GHz; two DIMM sockets, support up to 2 GB SDRAM: via CLE266 chipset: integrated AGP 4X 2D/3D graphic: 6-channel AC97 audio, dual LAN: one compact flash socket: 3 PCI and 4 ISA slots.
