Product Profile of Industrial Double Layer Printed Circuit Board
Industrial Double Layer Printed Circuit Board is made from CEM3 and FR4 laminates catering to automotive, peripherals and industrial automation sectors. The Printed Circuit Board is designed with a thickness of 0.8 to 3.2mm [with copper finishing Up to 3 Oz]. The Printed Circuit Board is offered in a line width and spacing of 6/ 6 mils [sample lots 5/5 mils]. Industrial Double Layer Printed Circuit Board comes in solder levelled, lead-free hot air levelled, chemical tin and chemical gold plated surface finish.
Key Features of Industrial Double Layer Printed Circuit Board
- Made from CEM3 and FR4 laminates.
- Thickness of 0.8 to 3.2mm [with copper finishing Up to 3 Oz].
- Line width and spacing of 6/ 6 mils.
- Minimum finished hole size of 0.3mm.
- Surface finish of Solder levelling, Lead-free hot air levelling, Chemical Tin, Chemical Gold.
- Automotive.
- Peripherals.
- Industrial Automation Sectors.
