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High Bonding Pumpable Water Based Lamination Adhesive

Supplier : Bhiwadi Polymers Ltd.

Key Features of High Bonding Pumpable Water Based Lamination Adhesive
  • Nice Gloss
  • High Bonding
  • Moderate Viscosity
  • High Coverage
  • DBM Base
  • Smooth Machinability
  • Dilutability is not necessary
  • Economical
  • All Weather Adhesive
  • Quick Drying
  • Pumpable
  • Good Heat Resistance
  • Good Low Temperature Properties
  • Moderate Tack
  • Proper Flow
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Product Profile of High Bonding Pumpable Water Based Lamination Adhesive
High Bonding Pumpable Water Based Lamination Adhesive ensures smooth machinability and does not require to be diluted. The Water Based Lamination Adhesive, available under the brand name "CHIPKO" of model LM101 exhibits quick drying and is suitable for weather condition. Bhiwadi Polymers Ltd., an ISO 9001-2000 accredited company is manufacturing High Bonding Pumpable Water Based Lamination Adhesive.

Bhiwadi Polymers Ltd. supplies a wide range of wood adhesive, lamination adhesive, rubber adhesive, binder, textile adhesive, PVAC emulsions, sealer, lacquer, thinner and labelling glue. The High Bonding Pumpable Water Based Lamination Adhesive is used for lamination of boards and paper to film and other inner lamination applications.

Key Features of High Bonding Pumpable Water Based Lamination Adhesive
  • Nice Gloss
  • High Bonding
  • Moderate Viscosity
  • High Coverage
  • DBM Base
  • Smooth Machinability
  • Dilutability is not necessary
  • Economical
  • All Weather Adhesive
  • Quick Drying
  • Pumpable
  • Good Heat Resistance
  • Good Low Temperature Properties
  • Moderate Tack
  • Proper Flow
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