Product Profile of Heat Sink Paste for PCBs` Thermal Management
Atotech India Ltd. offers Heat Sink Paste for PCBs` Thermal Management. The quality management system of Atotech India Ltd. holds ISO 9001 and ISO 14001 quality assurance certifications. Heat Sink Paste for PCBs` Thermal Management help solving PCB medium level thermal management problems such as heat transfer and dissipation. Heat Sink Paste for PCBs` Thermal Management allows flexibility in design and due to a reduced number of thermal interfaces is equally efficient. Heat Sink Paste for PCBs` Thermal Management distribute and transfer the heat of a heat source [e.g. a chip] to reduce its temperature to a lower level and improve this way the long-term reliability of the device to which it is applied.
Key Features of Heat Sink Paste for PCBs` Thermal Management
- Solves medium heat dissipation or cooling problems
- Very low thermal transfer resistance
- Potentially useful to reduce cost of laminates used
- High flexibility to take up thermal stress
- No solder mask required on top of the heatsink [cost, efficiency]
- Solder ball repellent [no solder residues]
- 100 % solids [no VOC]
- Excellent electrical characteristics sufficient insulation properties
- Excellent long term stability of required properties
