Product Profile of Epoxy Adhesive Epi -bond System
Electrocoating and Insulation Technologies Private Limited is offering Epoxy Adhesive EPI-Bond System. The company is engaged in developing and manufacturing various types of polymer coatings. The Epoxy Adhesive EPI -BOND is two part system comprising EPI Bond -A [Resin Part] and EPI Bond - B [Hardner Part]. This Epoxy Adhesive EPI-Bond is an adhesive system with two components for high bond strength applications. The Epoxy Adhesive EPI-Bond is available in 1 kg Polycontainer for Resin & 0.8 kgs for Hardener.
The Epoxy Adhesive EPI-Bond System has some salient features like:
Excellent adhesion to all materials.
Excellent electrical insulating properties.
High adhesive, tensile and share strength.
Thixotropic flow characteristics, useful for vertical surface.
Cured mass tough and elastic with high resistance to impact stress.
Application of this Epoxy Adhesive EPI-Bond System:
Fixing of break liners
Bonding of Ferrites, Magnetics
Joining wooden and metal patterns
