Product Profile of Electroplating Process
CMP Pvt. Ltd. since 1963 is the primary company manufacturing metal finishing products. The company offers Electroplating process and they are available in various models:
Copper Process-Cupsal Z - A sodium cyanide based solution recommended where simplicity and economy are important. Slow speed solution suitable for manual plant and general-purpose light copper plating. The deposit is dull.
High Efficiency Copper Process-Cupsal CX - A potassium cyanide based solution which produces a fine grained deposit. It is a high speed solution with excellent throwing power. It is appropriate for thick copper deposits and as an undercoat for bright nickel on steel and zinc based die-castings. Rack or barrel use.
High Efficiency Bright Copper-Cupsal CB - A potassium cyanide based solution which produces bright deposit. It is a high speed solution with excellent throwing power. Fully bright deposit ideal for use on zinc based die-casting.
Acid Copper-Cupsal AD - this is a fully bright acid copper with extremely high leveling power applicable for decorative use and electroforming. It is used for plating steel, since alloys and plastic components.
Rochelle Copper-Cupsal RH - it is a mildly alkaline, low cyanide based cooper plating process, designed for zinc based alloy die-castings.
