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Bump Testing Machine

Supplier : Micron

Key Features of Bump Testing Machine
  • Heavy duty structure
  • Adjustable drop height
  • Programmable Bump repetition rate
  • Compliance with JS55555, MIL-STD-810E and other relevant Defence Standards
  • PC Based Instrumentation for waveform analysis and monitoring
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Product Profile of Bump Testing Machine
The Bump Testing Machine is a versatile test equipment to carry out Shock/Bump tests. The machine is used for production qualification testing, transient analyses of structures or models and fatigue tests on sub-systems and parts with an object to determine their suitability under repetitive Shock/Bump environment [during transportation or in-service etc.] and to assess their structural integrity. Micron is manufacturing Bump Testing Machine.

Micron an ISO 9001:2000 registered organization, supplies a range of Electronic Instrumentation Systems like Data Acquisition Systems, Amplifier, Transducers & Indicating Devices, Digital Strain Indicator, Amplifier Trainer, Displacement Transducers, High Speed Centrifuge Machine and Vibration Test Equipment. The Bump Testing Machine is fabricated with welded steel of sufficient rigidity to provide necessary mechanical strength. The table or platform is lightweight, made of special alloy and having threaded holes at regular pitch to mount test objects. A provision is made to adjust the drop height by special electro mechanical/pneumatic arrangement between table and electrometric pad.

Key Features of Bump Testing Machine
  • Heavy duty structure
  • Adjustable drop height
  • Programmable Bump repetition rate
  • Compliance with JS55555, MIL-STD-810E and other relevant Defence Standards
  • PC Based Instrumentation for waveform analysis and monitoring
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